File:B-ad-schematicsu8bondingprocess.png
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| Description |
English: Schematic SU-8 wafer bond process. |
| Source | M. Wiemer and C. Jia and M. Töpper and K. Hauck, Wafer Bonding with BCB and SU-8 for MEMS Packaging (2006) |
| Author | Fraunhofer ENAS, D. Neumann |
| Permission (Reusing this file) |
   This file is licensed under the Creative Commons Attribution-Share Alike 3.0 Germany license. Attribution: Fraunhofer ENAS
 |
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| Date/Time | Thumbnail | Dimensions | User | Comment | |
|---|---|---|---|---|---|
| current | 08:59, 11 April 2011 | | 455 × 595 (11 KB) | Enaswiki | Improved colored area |
| 11:55, 10 April 2011 |  | 455 × 594 (10 KB) | Enaswiki | {{Information |Description ={{en|1=Schematic SU-8 wafer bond process.}} |Source ={{own}} |Author =Enaswiki |Date = |Permission ={{cc-by-sa-3.0-de|Fraunhofer ENAS}} |other_versions = }} |
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